MECHANIC Solder Paste XGSP30 20gm 183°C
MECHANIC Solder Paste XGSP30 20gm 183°C
1. Product: Lead-based Solder Paste (Sn63/Pb37)
2. Model: XGSP30
3. Weight: 20gm
4. Melting Point: 183°C
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135,00 EGP
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Description
MECHANIC Solder Paste XGSP30 is a lead-based Sn63/Pb37 solder paste designed for SMD component mounting, PCB repair, and fine-pitch soldering work.
With a melting point of 183°C, it’s formulated with a viscosity optimized for both stencil printing and manual application, giving flexibility for small-batch rework as well as more controlled stencil-based assembly.
Supplied in a 20gm quantity, this paste suits hobbyist and repair-shop soldering tasks where a reliable, standard-alloy solder paste is needed.
Features:
- Lead-based Sn63/Pb37 alloy composition
- Melting point: 183°C
- Viscosity suited for stencil printing and manual application
- 20gm supply quantity
- Suited for SMD mounting and fine-pitch soldering
نظرة عامة ومواصفات المنتج — بالعربية
MECHANIC Solder Paste XGSP30 20gm 183°C متوفر الآن في متجر إكوسترا للإلكترونيات، ضمن قسم Tools، بسعر 135,00 EGP. كود المنتج لدينا: EK1987. المنتج متوفر في المخزون وجاهز للشحن الفوري لكل محافظات مصر مع إمكانية الدفع عند الاستلام.
أهم المواصفات الفنية:
- Product: Lead-based Solder Paste (Sn63/Pb37)
- الموديل: XGSP30
- الوزن: 20gm
- Melting Point: 183°C
- Viscosity: Optimized for stencil printing and manual application
- الوزن: 1 g
منتج أصلي بجودة مضمونة من إكوسترا، مع دعم فني ومتابعة بعد البيع لكل عملائنا في مصر.
تصفّح المزيد من Tools في إكوسترا.
Specification
Specification
| WeightWeight | 10 g |
|---|---|
| Dimensions | 5 × 4 × 2 cm |
| Product | Lead-based Solder Paste (Sn63/Pb37) |
| Model | XGSP30 |
| Weight | 20gm |
| Melting Point | 183°C |
| Viscosity | Optimized for stencil printing and manual application |
